Multi Thermal Contact Resistance - MapleSim Help

Multi Thermal Contact Resistance

Multiple thermal contact resistance between two materials

 Description The Multi Thermal Contact Resistance component models multiple Thermal Contact Resistances. The total number of Thermal Contact Resistance components is determined by the Nodes parameter. The following example uses Thermal Contact Resistance components to explain the behavior of Thermal Contact Resistance component.
 Equations   (For details, see Thermal Contact Resistance  help).
 Variables (For details, see Thermal Contact Resistance  help).

Connections

 Name Condition Description Modelica ID $\mathrm{port_a}\left[i\right]$ i-th thermal port a port_a[i] $\mathrm{port_b}\left[i\right]$ i-th thermal port b port_b[i] $\mathrm{A_input}$ if use Apparent contact area input is true. Apparent contact area of each node is defined by Real signal input. A_input $\mathrm{Aratio_input}$ if use Area ratio input is true. Area ratio $\frac{\mathrm{A__c}}{A}$ of each node is defined by Real signal input. Aratio_input $\mathrm{L_input}$ if use Void space thickness input is true. Thickness of the void space is defined by Real signal input. L_input

Parameters

 Symbol Default Units Description Modelica ID $\mathrm{Material_a}$ $\mathrm{SolidPropertyData1}$ $-$ Solid material property data Material_a $\frac{W}{m\cdot K}$ Material_a.k is the thermal conductivity of the material of each port_a Material_a.k $\frac{J}{\mathrm{kg}\cdot K}$ Material_a.cp is the specific heat capacity of the material of each port_a Material_a.cp $\frac{\mathrm{kg}}{{m}^{3}}$ Material_a.rho is the density of the material of each port_a Material_a.rho $\mathrm{Material_b}$ $\mathrm{SolidPropertyData1}$ $-$ Solid material property data Material_b $\frac{W}{m\cdot K}$ Material_b.k is the thermal conductivity of the material of each port_b Material_b.k $\frac{J}{\mathrm{kg}\cdot K}$ Material_b.cp is the specific heat capacity of the material of each port_b Material_b.cp $\frac{\mathrm{kg}}{{m}^{3}}$ Material_b.rho is the density of the material of each port_b Material_b.rho $\mathrm{k__fluid}$ $0.0241$ $\frac{W}{m\cdot K}$ The thermal conductivity of the fluid which fills void space for each Thermal Contact Resistance kf $\mathrm{Nodes}$ $2$ $-$ Number of nodes numNode $A$ $0.0001$ ${m}^{2}$ Apparent contact area between materials for each Thermal Contact Resistance A_const $\frac{\mathrm{A__c}}{A}$ $-$ Area ratio $\frac{\mathrm{A__c}}{A}$ (between 0 and 1) for each Thermal Contact Resistance Aratio_const $L$ $m$ Thickness of the void space L_const